Projects per year
Fingerprint
- 1 Similar Profiles
Collaborations and top research areas from the last five years
-
АР13068587: 57-65 GHz Wireless Communication Front-End for Secure 5G Applications
Ukaegbu, I., Onyejegbu, E., Mokogwu, F., Shaimerden, Y., Shkoda, V. & Maken, S.
1/1/22 → 12/31/24
Project: MES RK
-
Development of AI-integrated Randomly Hopped LFM Photonic RADAR for Mitigating Interferences and Attackers in Autonomous Vehicles
Ukaegbu, I., Mustafa, M., Pavlenko, V. V., Nakarmi, B., Muthaiyah, S., Pan, S. & Wang, X.
1/1/22 → 12/31/24
Project: CRP
-
Development of 40 Gbps Memory Access Solutions for Next Generation Computing Systems and Applications
Ukaegbu, I., Nakarmi, B., Pan, S., Uddin, M. R. & Park, H.
1/1/21 → 12/31/23
Project: FDCRGP
-
Innovating Integrated Photovoltaics Based on Emerging Perovskite and Organic Materials for Architectural Electricity-Generating Glass
Ng, A., Ukaegbu, I., Balanay, M., Jumabekov, A., Ilyassov, B., Pavlenko, V. V. & Hu, H.
1/1/24 → 12/31/26
Project: CRP
-
A Comparative Study of Simulated and Hands-on Experiments in Teaching Computer Networks Laboratory Course
Kizilirmak, R. C., Kassayev, A. & Ukaegbu, I. A., 2023, EDUCON 2023 - IEEE Global Engineering Education Conference, Proceedings. IEEE Computer Society, (IEEE Global Engineering Education Conference, EDUCON; vol. 2023-May).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
-
Analysis and Mitigation of Interference in a Multi-RADAR Environment
Onyejegbu, E., Lee, A., Ashimbayeva, A., Nakarmi, B. & Ukaegbu, I. A., 2023, 7th IEEE Electron Devices Technology and Manufacturing Conference: Strengthen the Global Semiconductor Research Collaboration After the Covid-19 Pandemic, EDTM 2023. Institute of Electrical and Electronics Engineers Inc., (7th IEEE Electron Devices Technology and Manufacturing Conference: Strengthen the Global Semiconductor Research Collaboration After the Covid-19 Pandemic, EDTM 2023).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
-
FSO Link Attenuation Measurement in Extreme Winter Conditions for Secure 5G Applications
Khamidullin, A., Kizilirmak, R. C., Uysal, M. & Ukaegbu, I. A., 2023, Optical Interconnects XXIII. Chen, R. T. & Schroder, H. (eds.). SPIE, 124270C. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 12427).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
-
High-Speed Silicon Waveguide 3-to-8 Decoder Based on Electro-Optic Effects
Akhmet, A., Gaziz, A., Alipbayeva, N., Nakarmi, B. & Ukaegbu, I. A., 2023, Silicon Photonics XVIII. Reed, G. T. & Knights, A. P. (eds.). SPIE, 124260P. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 12426).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
-
Multi-chirp LFM Waveforms Generation with Reconfigurable Chirp Rates Using Optical Injection in a Semiconductor Laser
Nakarmi, B., Bai, Y. S., Ukaegbu, I. A., Parajuli, H. N., Ashimbayeva, A., Nakarmi, U., Wang, X. & Pan, S., 2023, (Accepted/In press) In: Journal of Lightwave Technology. p. 1-10 10 p.Research output: Contribution to journal › Article › peer-review