0.013 mm2 and Low‐power 10 Gb/s Transimpedance Amplifier for Short‐reach Optical Interconnects

Nga T. H. Nguyen, Ikechi Augustine Ukaegbu, Jamshid Sangirov, Mu-Hee Cho, Tae-Woo Lee, Hyo-Hoon Park

Research output: Contribution to journalArticle

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Abstract

A transimpedance amplifier (TIA) has been designed and implemented for short‐reach optical interconnect applications. The TIA, which is based on the regulated cascode technique, is implemented with a bandwidth enhancement technique, where capacitive degeneration and resistive feedback has been exploited in a 0.13 μm CMOS technology, while maintaining a small chip area and low power consumption. The TIA showed a measured transimpedance gain of 51dBΩ and works up to 10 Gb/s in the presence of 0.3 pF input photodiode capacitance. It occupies an active area of 0.013 mm2 with a power dissipation of 4.3 mW. The proposed TIA achieved high gain‐bandwidth product per DC power (GBP/DC) figure of merit of 589 GHzΩ/mW with an input referred noise of 20 pA/√Hz.
Original languageEnglish
Pages (from-to)2484-2487
JournalMicrowave and Optical Technology Letters
Volume55
Issue number10
Publication statusPublished - Oct 1 2013

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optical interconnects
Optical interconnects
Operational amplifiers
amplifiers
degeneration
Photodiodes
figure of merit
photodiodes
Energy dissipation
CMOS
Electric power utilization
Capacitance
dissipation
capacitance
direct current
chips
bandwidth
Feedback
Bandwidth
augmentation

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0.013 mm2 and Low‐power 10 Gb/s Transimpedance Amplifier for Short‐reach Optical Interconnects. / Nguyen, Nga T. H.; Ukaegbu, Ikechi Augustine; Sangirov, Jamshid; Cho, Mu-Hee; Lee, Tae-Woo; Park, Hyo-Hoon.

In: Microwave and Optical Technology Letters, Vol. 55, No. 10, 01.10.2013, p. 2484-2487.

Research output: Contribution to journalArticle

Nguyen, Nga T. H. ; Ukaegbu, Ikechi Augustine ; Sangirov, Jamshid ; Cho, Mu-Hee ; Lee, Tae-Woo ; Park, Hyo-Hoon. / 0.013 mm2 and Low‐power 10 Gb/s Transimpedance Amplifier for Short‐reach Optical Interconnects. In: Microwave and Optical Technology Letters. 2013 ; Vol. 55, No. 10. pp. 2484-2487.
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