2.5-Gb/s/ch Long Wavelength Transmitter Modules for Chip-to-Chip Optical PCB Applications

Ikechi Augustine Ukaegbu; Do-Won Kim; Mu-Hee Cho; Tae-Woo Lee; Hyo-Hoon Park

2.5-Gb/s/ch Long Wavelength Transmitter Modules for Chip-to-Chip Optical PCB Applications

Ikechi Augustine Ukaegbu, Do-Won Kim, Mu-Hee Cho, Tae-Woo Lee, Hyo-Hoon Park

School of Engineering and Digital Sciences

Research output: Contribution to journal › Article › peer-review

6 Citations (Scopus)

Abstract

We have fabricated 2.5-Gb/s/ch long wavelength optical transmitter modules in planar and multichip module structures for chip-to-chip optical printed-circuit board (OPCB) applications. Their performance has been analyzed and compared with two types of short wavelength structures. The long wavelength multichip module showed a 3-dB bandwidth of 2.46 GHz while the planar showed 2.16 GHz. The modules showed clear eye openings at 2.5 Gb/s with a bit-error rate less than 10 -12 and can be used for optical interconnections in OPCBs.

Original language	English
Pages (from-to)	1403-1405
Number of pages	3
Journal	IEEE Photonics Technology Letters
Volume	23
Issue number	19
Publication status	Published - Oct 1 2011

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title = "2.5-Gb/s/ch Long Wavelength Transmitter Modules for Chip-to-Chip Optical PCB Applications",

abstract = "We have fabricated 2.5-Gb/s/ch long wavelength optical transmitter modules in planar and multichip module structures for chip-to-chip optical printed-circuit board (OPCB) applications. Their performance has been analyzed and compared with two types of short wavelength structures. The long wavelength multichip module showed a 3-dB bandwidth of 2.46 GHz while the planar showed 2.16 GHz. The modules showed clear eye openings at 2.5 Gb/s with a bit-error rate less than 10 -12 and can be used for optical interconnections in OPCBs.",

author = "Ukaegbu, {Ikechi Augustine} and Do-Won Kim and Mu-Hee Cho and Tae-Woo Lee and Hyo-Hoon Park",

year = "2011",

month = oct,

day = "1",

language = "English",

volume = "23",

pages = "1403--1405",

journal = "IEEE Photonics Technology Letters",

issn = "1041-1135",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "19",

}

TY - JOUR

T1 - 2.5-Gb/s/ch Long Wavelength Transmitter Modules for Chip-to-Chip Optical PCB Applications

AU - Ukaegbu, Ikechi Augustine

AU - Kim, Do-Won

AU - Cho, Mu-Hee

AU - Lee, Tae-Woo

AU - Park, Hyo-Hoon

PY - 2011/10/1

Y1 - 2011/10/1

N2 - We have fabricated 2.5-Gb/s/ch long wavelength optical transmitter modules in planar and multichip module structures for chip-to-chip optical printed-circuit board (OPCB) applications. Their performance has been analyzed and compared with two types of short wavelength structures. The long wavelength multichip module showed a 3-dB bandwidth of 2.46 GHz while the planar showed 2.16 GHz. The modules showed clear eye openings at 2.5 Gb/s with a bit-error rate less than 10 -12 and can be used for optical interconnections in OPCBs.

AB - We have fabricated 2.5-Gb/s/ch long wavelength optical transmitter modules in planar and multichip module structures for chip-to-chip optical printed-circuit board (OPCB) applications. Their performance has been analyzed and compared with two types of short wavelength structures. The long wavelength multichip module showed a 3-dB bandwidth of 2.46 GHz while the planar showed 2.16 GHz. The modules showed clear eye openings at 2.5 Gb/s with a bit-error rate less than 10 -12 and can be used for optical interconnections in OPCBs.

M3 - Article

VL - 23

SP - 1403

EP - 1405

JO - IEEE Photonics Technology Letters

JF - IEEE Photonics Technology Letters

SN - 1041-1135

IS - 19

ER -