A novel approach to investigate the thermal comfort of the lightweight relocatable building integrated with PCM in different climates of Kazakhstan during summertime

Indira Adilkhanova, Shazim Ali Memon, Jong Kim, Almas Sheriyev

Research output: Contribution to journalArticlepeer-review

Abstract

This study investigates the potential of PCM and natural ventilation to strengthen the thermal comfort inside the lightweight relocatable building located in Kazakhstan during the summer period. The quantification of the impact of the PCM on the thermal comfort was accomplished using the concepts of maximum operative temperature reduction and discomfort index. A novel indicator of Total Discomfort Change (TDC) was introduced to select the optimum PCM. Thereafter, the behaviour of the optimised PCM was comprehensively evaluated through activation of PCM and PCM storage efficiency. In all cities, PCM 26 + NV showed the best performance achieving the TDC values of up to 1818 and its storage efficiency values were up to 39.1%. Then, the analysis of the effect of real PCMs on the thermal comfort conditions was provided. The investigation revealed that RT 26 + NV was the most efficient in all cities achieving the TDC values of up to 1977. Thereafter, the impact of climate change under RCP 8.5 emission scenario (2095) was assessed and RT 28 + NV and RT 26 + NV were found to be optimum combinations. Overall, the optimum configuration of PCM with natural ventilation can be used for improving the thermal comfort conditions during the summertime in all cities of Kazakhstan.

Original languageEnglish
Article number119390
JournalEnergy
Volume217
DOIs
Publication statusPublished - Feb 15 2021

Keywords

  • Discomfort Index
  • Lightweight relocatable building
  • PCM storage efficiency
  • Phase change material
  • Total Discomfort Change

ASJC Scopus subject areas

  • Civil and Structural Engineering
  • Building and Construction
  • Pollution
  • Mechanical Engineering
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

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