TY - GEN
T1 - Action-Driven Tactile Object Exploration for Shape Reconstruction via Silver Nanowire Injected Sensors
AU - Mussin, Tleukhan
AU - Kassym, Yermakhan
AU - Kabdyshev, Nurlan
AU - Kaikanov, Marat
AU - Kappassov, Zhanat
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - We present an action-driven tactile exploration system using flexible touch sensors integrated into the fingertips of a robot hand. These sensors are made from foams injected with silver nanotubes that exhibit resistance changes under pressure to enable tactile perception. A microcontroller-based unit captures the resistance, with communication deployed using the Robot Operating System. Our approach is evaluated in tactile object exploration, where robotic finger movements estimate the coordinates of the points of contact upon collisions with an object. Through repeated grasps, a point cloud of the shape of an object is generated. Distinct finger movements, or affordances, are developed to collect new contact points to discriminate four different shapes, including cube, cylinder, pyramid, and sphere. We benchmark our approach on medium and large sets of objects.
AB - We present an action-driven tactile exploration system using flexible touch sensors integrated into the fingertips of a robot hand. These sensors are made from foams injected with silver nanotubes that exhibit resistance changes under pressure to enable tactile perception. A microcontroller-based unit captures the resistance, with communication deployed using the Robot Operating System. Our approach is evaluated in tactile object exploration, where robotic finger movements estimate the coordinates of the points of contact upon collisions with an object. Through repeated grasps, a point cloud of the shape of an object is generated. Distinct finger movements, or affordances, are developed to collect new contact points to discriminate four different shapes, including cube, cylinder, pyramid, and sphere. We benchmark our approach on medium and large sets of objects.
UR - http://www.scopus.com/inward/record.url?scp=85186269839&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85186269839&partnerID=8YFLogxK
U2 - 10.1109/SII58957.2024.10417155
DO - 10.1109/SII58957.2024.10417155
M3 - Conference contribution
AN - SCOPUS:85186269839
T3 - 2024 IEEE/SICE International Symposium on System Integration, SII 2024
SP - 532
EP - 538
BT - 2024 IEEE/SICE International Symposium on System Integration, SII 2024
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2024 IEEE/SICE International Symposium on System Integration, SII 2024
Y2 - 8 January 2024 through 11 January 2024
ER -