An effective vision technique for microchip lead inspection

Nazim Mir-Nasiri; Haitham H.L. Al-Obaidy; Momoh J.E. Salami; Shamsuddin Amin

An effective vision technique for microchip lead inspection

Nazim Mir-Nasiri, Haitham H.L. Al-Obaidy, Momoh J.E. Salami, Shamsuddin Amin

Department of Electrical and Computer Engineering

Research output: Contribution to conference › Paper › peer-review

Abstract

A new effective method for the microchip lead inspection for the chip manufacturing industry has been developed in this work. In contrast to the gray scale pattern matching technique this approach employs selected parameters of binary blobs to perform fault detection and measurements. This leads to a significant reduction of image processing time. A special combination of gray level filtering techniques with gray morphological operations enhances the borders of the lead images. Newly developed threshold calibration technique significantly improves the measurement accuracy. A unique statistical analysis has been developed to identify all possible lead defects in the chips. This method is rotationally and scale invariant and able to detect defective leads for the chips with different specifications. The minimum required information about the microchip is the number of leads.

Original language	English
Pages	135-139
Number of pages	5
Publication status	Published - Dec 1 2003
Event	2003 IEEE International Conference on Industrial Technology, ICIT - Proceedings - Maribor, Slovenia Duration: Dec 10 2003 → Dec 12 2003

Other

Other	2003 IEEE International Conference on Industrial Technology, ICIT - Proceedings
Country	Slovenia
City	Maribor
Period	12/10/03 → 12/12/03

ASJC Scopus subject areas

Computer Science Applications
Electrical and Electronic Engineering

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abstract = "A new effective method for the microchip lead inspection for the chip manufacturing industry has been developed in this work. In contrast to the gray scale pattern matching technique this approach employs selected parameters of binary blobs to perform fault detection and measurements. This leads to a significant reduction of image processing time. A special combination of gray level filtering techniques with gray morphological operations enhances the borders of the lead images. Newly developed threshold calibration technique significantly improves the measurement accuracy. A unique statistical analysis has been developed to identify all possible lead defects in the chips. This method is rotationally and scale invariant and able to detect defective leads for the chips with different specifications. The minimum required information about the microchip is the number of leads.",

author = "Nazim Mir-Nasiri and Al-Obaidy, {Haitham H.L.} and Salami, {Momoh J.E.} and Shamsuddin Amin",

year = "2003",

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AU - Mir-Nasiri, Nazim

AU - Al-Obaidy, Haitham H.L.

AU - Salami, Momoh J.E.

AU - Amin, Shamsuddin

PY - 2003/12/1

Y1 - 2003/12/1

N2 - A new effective method for the microchip lead inspection for the chip manufacturing industry has been developed in this work. In contrast to the gray scale pattern matching technique this approach employs selected parameters of binary blobs to perform fault detection and measurements. This leads to a significant reduction of image processing time. A special combination of gray level filtering techniques with gray morphological operations enhances the borders of the lead images. Newly developed threshold calibration technique significantly improves the measurement accuracy. A unique statistical analysis has been developed to identify all possible lead defects in the chips. This method is rotationally and scale invariant and able to detect defective leads for the chips with different specifications. The minimum required information about the microchip is the number of leads.

AB - A new effective method for the microchip lead inspection for the chip manufacturing industry has been developed in this work. In contrast to the gray scale pattern matching technique this approach employs selected parameters of binary blobs to perform fault detection and measurements. This leads to a significant reduction of image processing time. A special combination of gray level filtering techniques with gray morphological operations enhances the borders of the lead images. Newly developed threshold calibration technique significantly improves the measurement accuracy. A unique statistical analysis has been developed to identify all possible lead defects in the chips. This method is rotationally and scale invariant and able to detect defective leads for the chips with different specifications. The minimum required information about the microchip is the number of leads.

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M3 - Paper

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T2 - 2003 IEEE International Conference on Industrial Technology, ICIT - Proceedings

Y2 - 10 December 2003 through 12 December 2003

ER -

An effective vision technique for microchip lead inspection

Abstract

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ASJC Scopus subject areas

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