An effective vision technique for microchip lead inspection

Nazim Mir-Nasiri, Haitham H.L. Al-Obaidy, Momoh J.E. Salami, Shamsuddin Amin

Research output: Contribution to conferencePaperpeer-review

Abstract

A new effective method for the microchip lead inspection for the chip manufacturing industry has been developed in this work. In contrast to the gray scale pattern matching technique this approach employs selected parameters of binary blobs to perform fault detection and measurements. This leads to a significant reduction of image processing time. A special combination of gray level filtering techniques with gray morphological operations enhances the borders of the lead images. Newly developed threshold calibration technique significantly improves the measurement accuracy. A unique statistical analysis has been developed to identify all possible lead defects in the chips. This method is rotationally and scale invariant and able to detect defective leads for the chips with different specifications. The minimum required information about the microchip is the number of leads.

Original languageEnglish
Pages135-139
Number of pages5
Publication statusPublished - Dec 1 2003
Event2003 IEEE International Conference on Industrial Technology, ICIT - Proceedings - Maribor, Slovenia
Duration: Dec 10 2003Dec 12 2003

Other

Other2003 IEEE International Conference on Industrial Technology, ICIT - Proceedings
CountrySlovenia
CityMaribor
Period12/10/0312/12/03

ASJC Scopus subject areas

  • Computer Science Applications
  • Electrical and Electronic Engineering

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