Keyphrases
Boron Carbide
11%
Curb
11%
Defect Density
11%
Defect Pair
22%
Grain Boundary
55%
Graphene
100%
Graphene Properties
11%
Heptagon
33%
Hetero
100%
Heterogeneous Structure
11%
Heterostructure
11%
Hexagonal Ring
11%
Increased Temperature
11%
Interfacial Thermal Resistance
11%
Kapitza Resistance
55%
Long-term Practice
11%
Molecular Dynamics Simulation
11%
Molecular Dynamics Study
100%
Nanoelectronics
11%
Nanosheets
100%
Negligible Effects
11%
Pentagon
33%
Resistance Increase
11%
Semiconductors
11%
Strain Gradient
11%
Temperature Effect
11%
Temperature Gradient
22%
Temperature Profile
11%
Temperature Strain
11%
Temperature Variation
11%
Thermal Load
11%
Thermal Properties
100%
Thermal Resistance
11%
Thermal Shock
11%
Topological Defects
11%
Tunable Properties
11%
Zero-strain
11%
INIS
asymmetry
12%
boron carbides
12%
comparative evaluations
12%
defects
62%
density
12%
grain boundaries
62%
graphene
100%
interfaces
12%
kapitza resistance
50%
molecular dynamics method
100%
nanoelectronics
12%
performance
12%
rings
12%
semiconductor materials
12%
simulation
25%
strains
37%
symmetry
25%
temperature gradients
25%
thermal properties
100%
topology
12%
values
12%
Material Science
Boron
11%
Carbide
11%
Defect Density
11%
Grain Boundary
55%
Graphene
100%
Heat Resistance
33%
Heterojunction
11%
Nanosheet
100%
Thermal Load
11%
Thermal Property
100%
Thermal Shock
11%
Engineering
Computer Simulation
11%
Curbs
11%
Defect Density
11%
Defects
44%
Grain Boundary
55%
Graphene
100%
Heterostructures
11%
Interfacial Thermal Resistance
11%
Nanoelectronics
11%
Nanosheet
100%
Negligible Effect
11%
Strain Gradient
11%
Temperature Gradient
22%
Temperature Profile
11%
Thermal Load
11%
Thermal Resistance
22%
Chemical Engineering
Boron Carbide
11%
Graphene
100%
Nanosheet
100%
Thermal Gradient
22%
Thermal Load
11%
Thermal Shock
11%