TY - GEN
T1 - Analysis of surface and subsurface damage of micro-ground Bk7 glass using on machine fabricated PCD micro-tool
AU - Perveen, A.
AU - Rahman, M.
AU - Wong, Y. S.
PY - 2012/1/1
Y1 - 2012/1/1
N2 - This paper presents the research results of the morphology of subsurface damage (SSD) in BK7 glass ground with on-machine fabricated PCD micro tool. Grinding generated damages during this process are assessed and characterized using bonding interface sectioning technique combined with field emission scanning electron microscopy (FESEM). Both the damage depth and surface roughness are found to be influenced by the depth of cut, and spindle speed. In addition to this, two major type of grinding damage have been identified likely chipping damage and micro-cracking damage. Lateral, median and cone cracks are found to be existed in the sub-surface. As long as the cutting points are unloaded and residue can escape; the material is removed in a combined brittle and ductile mode. When the cutting surface is loaded with residue, the tool work piece interface temperature becomes so high that the material is removed by plastic flow. Hence the surface is polished with fine debris. Unfortunately, as this surface cools down, thermal quenching produces a network of crack. Although the machined surface seems to be show ductile mode of cutting behaviour even at higher material removal, analysis of subsurface damage shows that the material removal is a combined effect of grain dislodgement, micro-cracking and plastic deformation. These results provide valuable insight into the grinding damage induced due to the properties of glass as well as process parameters.
AB - This paper presents the research results of the morphology of subsurface damage (SSD) in BK7 glass ground with on-machine fabricated PCD micro tool. Grinding generated damages during this process are assessed and characterized using bonding interface sectioning technique combined with field emission scanning electron microscopy (FESEM). Both the damage depth and surface roughness are found to be influenced by the depth of cut, and spindle speed. In addition to this, two major type of grinding damage have been identified likely chipping damage and micro-cracking damage. Lateral, median and cone cracks are found to be existed in the sub-surface. As long as the cutting points are unloaded and residue can escape; the material is removed in a combined brittle and ductile mode. When the cutting surface is loaded with residue, the tool work piece interface temperature becomes so high that the material is removed by plastic flow. Hence the surface is polished with fine debris. Unfortunately, as this surface cools down, thermal quenching produces a network of crack. Although the machined surface seems to be show ductile mode of cutting behaviour even at higher material removal, analysis of subsurface damage shows that the material removal is a combined effect of grain dislodgement, micro-cracking and plastic deformation. These results provide valuable insight into the grinding damage induced due to the properties of glass as well as process parameters.
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M3 - Conference contribution
AN - SCOPUS:84911390034
T3 - Proceedings of the 12th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2012
SP - 505
EP - 511
BT - Proceedings of the 12th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2012
A2 - Spaan, H.
A2 - Burke, Theresa
A2 - Shore, Paul
PB - euspen
T2 - 12th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2012
Y2 - 4 June 2012 through 7 June 2012
ER -