Analysis of thermal effects on crosstalk and performance of optoelectronic transmitter modules

Ikechi Augustine Ukaegbu, Jamshid Sangirov, Tae-Woo Lee, Mu-Hee Cho, Hyo-Hoon Park

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

In this work, an analytical model based on interconnect parameters is presented for the analysis of thermal effects on crosstalk and performance of multi-channel optoelectronic modules. The model is used to determine the thermal critical frequency, fcrit, above which signals becomes severely deteriorated and can be applied in the design and packaging of optoelectronic modules for reliable data transmission.
Original languageEnglish
Title of host publication2012 17th Opto-Electronics and Communications Conference
PublisherIEEE
Pages537-538
Number of pages2
Publication statusPublished - Aug 23 2012

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