In this work, an analytical model based on interconnect parameters is presented for the analysis of thermal effects on crosstalk and performance of multi-channel optoelectronic modules. The model is used to determine the thermal critical frequency, fcrit, above which signals becomes severely deteriorated and can be applied in the design and packaging of optoelectronic modules for reliable data transmission.
|Title of host publication||2012 17th Opto-Electronics and Communications Conference|
|Number of pages||2|
|Publication status||Published - Aug 23 2012|