Analytical model for crosstalk analysis of optoelectronic transmitter modules for optical interconnects

Ikechi Augustine Ukaegbu, Jamshid Sangirov, Mu-Hee Cho, Tae-Woo Lee, Hyo-Hoon Park

Research output: Contribution to journalArticlepeer-review

5 Citations (Scopus)

Abstract

In this paper, a crosstalk expression and equivalent circuit model have been proposed based on RLC line model and interconnect parameters for wire-bonded and flip-chip bonded multichannel optoelectronic modules. The analytical expression and model are accurate for computing crosstalk of interconnects used in chip packaging. In addition, full-wave simulation and experimental results from total crosstalk measurement are discussed.
Original languageEnglish
Pages (from-to)075401-1 - 075401-8
Number of pages8
JournalOptical Engineering
Volume50
Issue number7
Publication statusPublished - Jul 1 2011

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