Abstract
In this paper, a crosstalk expression and equivalent circuit model have been proposed based on RLC line model and interconnect parameters for wire-bonded and flip-chip bonded multichannel optoelectronic modules. The analytical expression and model are accurate for computing crosstalk of interconnects used in chip packaging. In addition, full-wave simulation and experimental results from total crosstalk measurement are discussed.
Original language | English |
---|---|
Pages (from-to) | 075401-1 - 075401-8 |
Number of pages | 8 |
Journal | Optical Engineering |
Volume | 50 |
Issue number | 7 |
Publication status | Published - Jul 1 2011 |