Analytical model for crosstalk analysis of optoelectronic transmitter modules for optical interconnects

Ikechi Augustine Ukaegbu; Jamshid Sangirov; Mu-Hee Cho; Tae-Woo Lee; Hyo-Hoon Park

Analytical model for crosstalk analysis of optoelectronic transmitter modules for optical interconnects

Ikechi Augustine Ukaegbu, Jamshid Sangirov, Mu-Hee Cho, Tae-Woo Lee, Hyo-Hoon Park

School of Engineering and Digital Sciences

Research output: Contribution to journal › Article › peer-review

5 Citations (Scopus)

Abstract

In this paper, a crosstalk expression and equivalent circuit model have been proposed based on RLC line model and interconnect parameters for wire-bonded and flip-chip bonded multichannel optoelectronic modules. The analytical expression and model are accurate for computing crosstalk of interconnects used in chip packaging. In addition, full-wave simulation and experimental results from total crosstalk measurement are discussed.

Original language	English
Pages (from-to)	075401-1 - 075401-8
Number of pages	8
Journal	Optical Engineering
Volume	50
Issue number	7
Publication status	Published - Jul 1 2011

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@article{e10dbd6c3dff46bd8a73034a04296ce6,

title = "Analytical model for crosstalk analysis of optoelectronic transmitter modules for optical interconnects",

abstract = "In this paper, a crosstalk expression and equivalent circuit model have been proposed based on RLC line model and interconnect parameters for wire-bonded and flip-chip bonded multichannel optoelectronic modules. The analytical expression and model are accurate for computing crosstalk of interconnects used in chip packaging. In addition, full-wave simulation and experimental results from total crosstalk measurement are discussed.",

author = "Ukaegbu, {Ikechi Augustine} and Jamshid Sangirov and Mu-Hee Cho and Tae-Woo Lee and Hyo-Hoon Park",

year = "2011",

month = jul,

day = "1",

language = "English",

volume = "50",

pages = "075401--1 -- 075401--8",

journal = "Optical Engineering",

issn = "0091-3286",

publisher = "SPIE",

number = "7",

}

TY - JOUR

T1 - Analytical model for crosstalk analysis of optoelectronic transmitter modules for optical interconnects

AU - Ukaegbu, Ikechi Augustine

AU - Sangirov, Jamshid

AU - Cho, Mu-Hee

AU - Lee, Tae-Woo

AU - Park, Hyo-Hoon

PY - 2011/7/1

Y1 - 2011/7/1

N2 - In this paper, a crosstalk expression and equivalent circuit model have been proposed based on RLC line model and interconnect parameters for wire-bonded and flip-chip bonded multichannel optoelectronic modules. The analytical expression and model are accurate for computing crosstalk of interconnects used in chip packaging. In addition, full-wave simulation and experimental results from total crosstalk measurement are discussed.

AB - In this paper, a crosstalk expression and equivalent circuit model have been proposed based on RLC line model and interconnect parameters for wire-bonded and flip-chip bonded multichannel optoelectronic modules. The analytical expression and model are accurate for computing crosstalk of interconnects used in chip packaging. In addition, full-wave simulation and experimental results from total crosstalk measurement are discussed.

M3 - Article

VL - 50

SP - 075401-1 - 075401-8

JO - Optical Engineering

JF - Optical Engineering

SN - 0091-3286

IS - 7

ER -