Effect of H2 on the etch profile of InP/InGaAsP alloys in Cl2/Ar/H2 inductively coupled plasma reactive ion etching chemistries for photonic device fabrication

Sean L. Rommel, Jae Hyung Jang, Wu Lu, Gabriel Cueva, Ling Zhou, Ilesanmi Adesida, Gary Pajer, Ralph Whaley, Allen Lepore, Zane Schellanbarger, Joseph H. Abeles

Research output: Contribution to journalConference articlepeer-review

61 Citations (Scopus)

Abstract

The positive impact of the addition of H2 to a Cl2/Ar process for the etching of InP-based heterostructures was demonstrated. It was found that the addition of H2 balances the physical and chemical components, resulting in three distinct etch profiles. A racetrack resonator with a quality factor of 8000 was also demonstrated.

Original languageEnglish
Pages (from-to)1327-1330
Number of pages4
JournalJournal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Volume20
Issue number4
DOIs
Publication statusPublished - Jul 2002
Externally publishedYes
EventProceedings of the 29th Conference on the Physics and Chemistry of Semiconductor Interfaces - Santa Fe, NM, United States
Duration: Jan 6 2002Jan 10 2002

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Fingerprint

Dive into the research topics of 'Effect of H2 on the etch profile of InP/InGaAsP alloys in Cl2/Ar/H2 inductively coupled plasma reactive ion etching chemistries for photonic device fabrication'. Together they form a unique fingerprint.

Cite this