Effect of “Wire-bonded” and “Bend-pattern” Transmission Lines for High-Speed COB Optical Interconnects Applications

Ikechi Augustine Ukaegbu, Yoon-Gu Kwon, Jamshid Sangirov, Tae-Woo Lee, Mu-Hee Cho, Chang-Bong Kim, Hyo-Hoon Park

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The effect of wire-bond and bent transmission line patterns on FR4 and Ceramic substrates have been investigated for high speed chip-on-board (COB) based optical interconnect applications. From simulation data, the ceramic based transmission lines have shown superior characteristics. Thus, in this work, we have designed and fabricated wire bonds of varying lengths and bent transmission line patterns to validate the simulation results. Wire-bonded metal gaps of length 0.3~0.9mm and metal traces with 0~3 bends on ceramic based COB showed good transmission characteristics for >10Gb/s COB based optoelectronic interconnect applications.
Original languageEnglish
Title of host publicationProceedings of the 20th Conference on Optoelectronics and Optical Communications (COOC 2013)
PublisherOptical Society of Korea
Number of pages2
Publication statusPublished - May 1 2013

Fingerprint Dive into the research topics of 'Effect of “Wire-bonded” and “Bend-pattern” Transmission Lines for High-Speed COB Optical Interconnects Applications'. Together they form a unique fingerprint.

Cite this