Effect of “Wire-bonded” and “Bend-pattern” Transmission Lines for High-Speed COB Optical Interconnects Applications

Ikechi Augustine Ukaegbu, Yoon-Gu Kwon, Jamshid Sangirov, Tae-Woo Lee, Mu-Hee Cho, Chang-Bong Kim, Hyo-Hoon Park

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The effect of wire-bond and bent transmission line patterns on FR4 and Ceramic substrates have been investigated for high speed chip-on-board (COB) based optical interconnect applications. From simulation data, the ceramic based transmission lines have shown superior characteristics. Thus, in this work, we have designed and fabricated wire bonds of varying lengths and bent transmission line patterns to validate the simulation results. Wire-bonded metal gaps of length 0.3~0.9mm and metal traces with 0~3 bends on ceramic based COB showed good transmission characteristics for >10Gb/s COB based optoelectronic interconnect applications.
Original languageEnglish
Title of host publicationProceedings of the 20th Conference on Optoelectronics and Optical Communications (COOC 2013)
PublisherOptical Society of Korea
Number of pages2
Publication statusPublished - May 1 2013

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Optical interconnects
Electric lines
Wire
Optoelectronic devices
Substrates
Metals

Cite this

Ukaegbu, I. A., Kwon, Y-G., Sangirov, J., Lee, T-W., Cho, M-H., Kim, C-B., & Park, H-H. (2013). Effect of “Wire-bonded” and “Bend-pattern” Transmission Lines for High-Speed COB Optical Interconnects Applications. In Proceedings of the 20th Conference on Optoelectronics and Optical Communications (COOC 2013) Optical Society of Korea.

Effect of “Wire-bonded” and “Bend-pattern” Transmission Lines for High-Speed COB Optical Interconnects Applications. / Ukaegbu, Ikechi Augustine; Kwon, Yoon-Gu; Sangirov, Jamshid; Lee, Tae-Woo; Cho, Mu-Hee; Kim, Chang-Bong; Park, Hyo-Hoon.

Proceedings of the 20th Conference on Optoelectronics and Optical Communications (COOC 2013). Optical Society of Korea, 2013.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ukaegbu, IA, Kwon, Y-G, Sangirov, J, Lee, T-W, Cho, M-H, Kim, C-B & Park, H-H 2013, Effect of “Wire-bonded” and “Bend-pattern” Transmission Lines for High-Speed COB Optical Interconnects Applications. in Proceedings of the 20th Conference on Optoelectronics and Optical Communications (COOC 2013). Optical Society of Korea.
Ukaegbu IA, Kwon Y-G, Sangirov J, Lee T-W, Cho M-H, Kim C-B et al. Effect of “Wire-bonded” and “Bend-pattern” Transmission Lines for High-Speed COB Optical Interconnects Applications. In Proceedings of the 20th Conference on Optoelectronics and Optical Communications (COOC 2013). Optical Society of Korea. 2013
Ukaegbu, Ikechi Augustine ; Kwon, Yoon-Gu ; Sangirov, Jamshid ; Lee, Tae-Woo ; Cho, Mu-Hee ; Kim, Chang-Bong ; Park, Hyo-Hoon. / Effect of “Wire-bonded” and “Bend-pattern” Transmission Lines for High-Speed COB Optical Interconnects Applications. Proceedings of the 20th Conference on Optoelectronics and Optical Communications (COOC 2013). Optical Society of Korea, 2013.
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AU - Lee, Tae-Woo

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N2 - The effect of wire-bond and bent transmission line patterns on FR4 and Ceramic substrates have been investigated for high speed chip-on-board (COB) based optical interconnect applications. From simulation data, the ceramic based transmission lines have shown superior characteristics. Thus, in this work, we have designed and fabricated wire bonds of varying lengths and bent transmission line patterns to validate the simulation results. Wire-bonded metal gaps of length 0.3~0.9mm and metal traces with 0~3 bends on ceramic based COB showed good transmission characteristics for >10Gb/s COB based optoelectronic interconnect applications.

AB - The effect of wire-bond and bent transmission line patterns on FR4 and Ceramic substrates have been investigated for high speed chip-on-board (COB) based optical interconnect applications. From simulation data, the ceramic based transmission lines have shown superior characteristics. Thus, in this work, we have designed and fabricated wire bonds of varying lengths and bent transmission line patterns to validate the simulation results. Wire-bonded metal gaps of length 0.3~0.9mm and metal traces with 0~3 bends on ceramic based COB showed good transmission characteristics for >10Gb/s COB based optoelectronic interconnect applications.

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