The effect of wire-bond and bent transmission line patterns on FR4 and Ceramic substrates have been investigated for high speed chip-on-board (COB) based optical interconnect applications. From simulation data, the ceramic based transmission lines have shown superior characteristics. Thus, in this work, we have designed and fabricated wire bonds of varying lengths and bent transmission line patterns to validate the simulation results. Wire-bonded metal gaps of length 0.3~0.9mm and metal traces with 0~3 bends on ceramic based COB showed good transmission characteristics for >10Gb/s COB based optoelectronic interconnect applications.
|Title of host publication||Proceedings of the 20th Conference on Optoelectronics and Optical Communications (COOC 2013)|
|Publisher||Optical Society of Korea|
|Number of pages||2|
|Publication status||Published - May 1 2013|