This work demonstrates the thermal analysis for efficient heat dissipation for optoelectronic transmitter modules. A Teflon-based thermal printed circuit board (PCB) has been designed for packaging the designed and fabricated transmitter modules to ensure efficient heat dissipation. The thermal and performance analysis of the packaged modules show that the chips operate at temperatures below 40 °C which is apt for reliable signal transmission.
|Title of host publication||International Conference on Photonics in Switching (PS)|
|Number of pages||3|
|Publication status||Published - Sep 26 2013|
Ukaegbu, I. A., Lee, T-W., Cho, M-H., Park, H-H., & Sangirov, J. (2013). Efficient heat dissipation in optoelectronic transmitter modules using thermally enhanced PCB. In International Conference on Photonics in Switching (PS) (pp. 1-3). IEEE.