Efficient heat dissipation in optoelectronic transmitter modules using thermally enhanced PCB

Ikechi Augustine Ukaegbu, Tae-Woo Lee, Mu-Hee Cho, Hyo-Hoon Park, Jamshid Sangirov

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This work demonstrates the thermal analysis for efficient heat dissipation for optoelectronic transmitter modules. A Teflon-based thermal printed circuit board (PCB) has been designed for packaging the designed and fabricated transmitter modules to ensure efficient heat dissipation. The thermal and performance analysis of the packaged modules show that the chips operate at temperatures below 40 °C which is apt for reliable signal transmission.
Original languageEnglish
Title of host publicationInternational Conference on Photonics in Switching (PS)
PublisherIEEE
Pages1-3
Number of pages3
Publication statusPublished - Sep 26 2013

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  • Cite this

    Ukaegbu, I. A., Lee, T-W., Cho, M-H., Park, H-H., & Sangirov, J. (2013). Efficient heat dissipation in optoelectronic transmitter modules using thermally enhanced PCB. In International Conference on Photonics in Switching (PS) (pp. 1-3). IEEE.