Efficient high-speed optoelectronic interconnects parameter extraction based on 3D field simulation

Ikechi Augustine Ukaegbu; Tae-Woo Lee; Hyo-Hoon Park

Efficient high-speed optoelectronic interconnects parameter extraction based on 3D field simulation

Ikechi Augustine Ukaegbu, Tae-Woo Lee, Hyo-Hoon Park

School of Engineering and Digital Sciences

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

As the speed of integrated circuits increases, inductive coupling becomes an issue for the packaging interconnect technologies. This paper describes equivalent circuit extraction based on 3D full wave simulation for optoelectronic transmitter packaging interconnects. Simulation and extraction are performed for two kinds of transmitter modules: planar and multi-chip modules. The extracted equivalent circuit model of the optoelectronic interconnects is accurate and can be applied in packaging design state-of-the-art.

Original language	English
Title of host publication	13th International Conference on Advanced Communication Technology (ICACT2011)
Publisher	IEEE
Pages	244-247
Number of pages	4
Publication status	Published - Apr 7 2012

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title = "Efficient high-speed optoelectronic interconnects parameter extraction based on 3D field simulation",

abstract = "As the speed of integrated circuits increases, inductive coupling becomes an issue for the packaging interconnect technologies. This paper describes equivalent circuit extraction based on 3D full wave simulation for optoelectronic transmitter packaging interconnects. Simulation and extraction are performed for two kinds of transmitter modules: planar and multi-chip modules. The extracted equivalent circuit model of the optoelectronic interconnects is accurate and can be applied in packaging design state-of-the-art.",

author = "Ukaegbu, {Ikechi Augustine} and Tae-Woo Lee and Hyo-Hoon Park",

year = "2012",

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booktitle = "13th International Conference on Advanced Communication Technology (ICACT2011)",

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AU - Ukaegbu, Ikechi Augustine

AU - Lee, Tae-Woo

AU - Park, Hyo-Hoon

PY - 2012/4/7

Y1 - 2012/4/7

N2 - As the speed of integrated circuits increases, inductive coupling becomes an issue for the packaging interconnect technologies. This paper describes equivalent circuit extraction based on 3D full wave simulation for optoelectronic transmitter packaging interconnects. Simulation and extraction are performed for two kinds of transmitter modules: planar and multi-chip modules. The extracted equivalent circuit model of the optoelectronic interconnects is accurate and can be applied in packaging design state-of-the-art.

AB - As the speed of integrated circuits increases, inductive coupling becomes an issue for the packaging interconnect technologies. This paper describes equivalent circuit extraction based on 3D full wave simulation for optoelectronic transmitter packaging interconnects. Simulation and extraction are performed for two kinds of transmitter modules: planar and multi-chip modules. The extracted equivalent circuit model of the optoelectronic interconnects is accurate and can be applied in packaging design state-of-the-art.

M3 - Conference contribution

SP - 244

EP - 247

BT - 13th International Conference on Advanced Communication Technology (ICACT2011)

PB - IEEE

ER -