TY - GEN
T1 - Experimental study on the use of PCM-based heat sink for cooling of mobile devices
AU - Wong, H. E.
AU - Tan, F. L.
AU - Fok, S. C.
PY - 2008
Y1 - 2008
N2 - An experimental study is conducted on the cooling of portable electronic devices using PCM-based heat sinks. The design uses different aluminum heat sinks filled with neicosane to store and dissipate the generated heat. The temperature profiles at three different power levels, (i.e. 3 W, 4 W and 5 W) for three different positions (i.e. horizontally, vertically and inclined at 45° to the horizontal) are measured. In addition, the surface temperature of each setup is captured with a thermal imager. The experimental results indicate that the PCM-based heat sinks can be used to effectively manage the temperature of portable electronic devices. Based on this finding, mathematical models are currently being developed to facilitate the optimal designs of PCM-based heat sinks.
AB - An experimental study is conducted on the cooling of portable electronic devices using PCM-based heat sinks. The design uses different aluminum heat sinks filled with neicosane to store and dissipate the generated heat. The temperature profiles at three different power levels, (i.e. 3 W, 4 W and 5 W) for three different positions (i.e. horizontally, vertically and inclined at 45° to the horizontal) are measured. In addition, the surface temperature of each setup is captured with a thermal imager. The experimental results indicate that the PCM-based heat sinks can be used to effectively manage the temperature of portable electronic devices. Based on this finding, mathematical models are currently being developed to facilitate the optimal designs of PCM-based heat sinks.
UR - http://www.scopus.com/inward/record.url?scp=63049102543&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=63049102543&partnerID=8YFLogxK
U2 - 10.1109/EPTC.2008.4763521
DO - 10.1109/EPTC.2008.4763521
M3 - Conference contribution
AN - SCOPUS:63049102543
SN - 9781424421183
T3 - 10th Electronics Packaging Technology Conference, EPTC 2008
SP - 743
EP - 748
BT - 10th Electronics Packaging Technology Conference, EPTC 2008
T2 - 10th Electronics Packaging Technology Conference, EPTC 2008
Y2 - 9 December 2008 through 12 December 2008
ER -