Experimental study on the use of PCM-based heat sink for cooling of mobile devices

H. E. Wong, F. L. Tan, S. C. Fok

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

An experimental study is conducted on the cooling of portable electronic devices using PCM-based heat sinks. The design uses different aluminum heat sinks filled with neicosane to store and dissipate the generated heat. The temperature profiles at three different power levels, (i.e. 3 W, 4 W and 5 W) for three different positions (i.e. horizontally, vertically and inclined at 45° to the horizontal) are measured. In addition, the surface temperature of each setup is captured with a thermal imager. The experimental results indicate that the PCM-based heat sinks can be used to effectively manage the temperature of portable electronic devices. Based on this finding, mathematical models are currently being developed to facilitate the optimal designs of PCM-based heat sinks.

Original languageEnglish
Title of host publication10th Electronics Packaging Technology Conference, EPTC 2008
Pages743-748
Number of pages6
DOIs
Publication statusPublished - 2008
Externally publishedYes
Event10th Electronics Packaging Technology Conference, EPTC 2008 - Singapore, Singapore
Duration: Dec 9 2008Dec 12 2008

Publication series

Name10th Electronics Packaging Technology Conference, EPTC 2008

Conference

Conference10th Electronics Packaging Technology Conference, EPTC 2008
CountrySingapore
CitySingapore
Period12/9/0812/12/08

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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