Experimental study on the use of PCM-based heat sink for cooling of mobile devices

H. E. Wong; F. L. Tan; S. C. Fok

doi:10.1109/EPTC.2008.4763521

Experimental study on the use of PCM-based heat sink for cooling of mobile devices

H. E. Wong, F. L. Tan, S. C. Fok

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

6 Citations (Scopus)

Abstract

An experimental study is conducted on the cooling of portable electronic devices using PCM-based heat sinks. The design uses different aluminum heat sinks filled with neicosane to store and dissipate the generated heat. The temperature profiles at three different power levels, (i.e. 3 W, 4 W and 5 W) for three different positions (i.e. horizontally, vertically and inclined at 45° to the horizontal) are measured. In addition, the surface temperature of each setup is captured with a thermal imager. The experimental results indicate that the PCM-based heat sinks can be used to effectively manage the temperature of portable electronic devices. Based on this finding, mathematical models are currently being developed to facilitate the optimal designs of PCM-based heat sinks.

Original language	English
Title of host publication	10th Electronics Packaging Technology Conference, EPTC 2008
Pages	743-748
Number of pages	6
DOIs	https://doi.org/10.1109/EPTC.2008.4763521
Publication status	Published - 2008
Externally published	Yes
Event	10th Electronics Packaging Technology Conference, EPTC 2008 - Singapore, Singapore Duration: Dec 9 2008 → Dec 12 2008

Publication series

Name	10th Electronics Packaging Technology Conference, EPTC 2008

Conference

Conference	10th Electronics Packaging Technology Conference, EPTC 2008
Country	Singapore
City	Singapore
Period	12/9/08 → 12/12/08

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering

Access to Document

10.1109/EPTC.2008.4763521

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Cite this

Wong, HE, Tan, FL & Fok, SC 2008, Experimental study on the use of PCM-based heat sink for cooling of mobile devices. in 10th Electronics Packaging Technology Conference, EPTC 2008., 4763521, 10th Electronics Packaging Technology Conference, EPTC 2008, pp. 743-748, 10th Electronics Packaging Technology Conference, EPTC 2008, Singapore, Singapore, 12/9/08. https://doi.org/10.1109/EPTC.2008.4763521

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abstract = "An experimental study is conducted on the cooling of portable electronic devices using PCM-based heat sinks. The design uses different aluminum heat sinks filled with neicosane to store and dissipate the generated heat. The temperature profiles at three different power levels, (i.e. 3 W, 4 W and 5 W) for three different positions (i.e. horizontally, vertically and inclined at 45° to the horizontal) are measured. In addition, the surface temperature of each setup is captured with a thermal imager. The experimental results indicate that the PCM-based heat sinks can be used to effectively manage the temperature of portable electronic devices. Based on this finding, mathematical models are currently being developed to facilitate the optimal designs of PCM-based heat sinks.",

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