Abstract
The memristor can be used as non volatile memory (NVM) and for emulating neuron behavior. It has the ability to switch between low resistance R on and high resistance values R off, and exhibit the synaptic dynamic behaviour such as potentiation and depression. This paper presents a study on potentiation and depression of memristors in Quad Flat Pack. A comparison is drawn between the memristors with and without the impact of parasitics of packaging, using measured data and equivalent circuit models. The parameters in memristor and packaging models for the SPICE simulations were determined using measured data to reflect the memristor parasitics in Quad Flat Packs.
| Original language | English |
|---|---|
| Title of host publication | IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2018 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| ISBN (Electronic) | 9781538665923 |
| DOIs | |
| Publication status | Published - Apr 2 2019 |
| Event | 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2018 - Chandigarh, India Duration: Dec 16 2018 → Dec 18 2018 |
Publication series
| Name | IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2018 |
|---|
Conference
| Conference | 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2018 |
|---|---|
| Country | India |
| City | Chandigarh |
| Period | 12/16/18 → 12/18/18 |
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Keywords
- IC package
- Memristors
- Quad Flat Pack
- Synaptic Dynamics
ASJC Scopus subject areas
- Electrical and Electronic Engineering
Cite this
Impact of Integrated Circuit Packaging on Synaptic Dynamics of Memristive Devices. / Irmanova, Aidana; Ellis, Grant A.; James Pappachen, Alex.
IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2018. Institute of Electrical and Electronics Engineers Inc., 2019. 8680861 (IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2018).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Impact of Integrated Circuit Packaging on Synaptic Dynamics of Memristive Devices
AU - Irmanova, Aidana
AU - Ellis, Grant A.
AU - James Pappachen, Alex
PY - 2019/4/2
Y1 - 2019/4/2
N2 - The memristor can be used as non volatile memory (NVM) and for emulating neuron behavior. It has the ability to switch between low resistance R on and high resistance values R off, and exhibit the synaptic dynamic behaviour such as potentiation and depression. This paper presents a study on potentiation and depression of memristors in Quad Flat Pack. A comparison is drawn between the memristors with and without the impact of parasitics of packaging, using measured data and equivalent circuit models. The parameters in memristor and packaging models for the SPICE simulations were determined using measured data to reflect the memristor parasitics in Quad Flat Packs.
AB - The memristor can be used as non volatile memory (NVM) and for emulating neuron behavior. It has the ability to switch between low resistance R on and high resistance values R off, and exhibit the synaptic dynamic behaviour such as potentiation and depression. This paper presents a study on potentiation and depression of memristors in Quad Flat Pack. A comparison is drawn between the memristors with and without the impact of parasitics of packaging, using measured data and equivalent circuit models. The parameters in memristor and packaging models for the SPICE simulations were determined using measured data to reflect the memristor parasitics in Quad Flat Packs.
KW - IC package
KW - Memristors
KW - Quad Flat Pack
KW - Synaptic Dynamics
UR - http://www.scopus.com/inward/record.url?scp=85064716322&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85064716322&partnerID=8YFLogxK
U2 - 10.1109/EDAPS.2018.8680861
DO - 10.1109/EDAPS.2018.8680861
M3 - Conference contribution
AN - SCOPUS:85064716322
T3 - IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2018
BT - IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2018
PB - Institute of Electrical and Electronics Engineers Inc.
ER -