@inproceedings{a7adbf4ac43e4f5db639623b9cf6e7f5,
title = "Integrated optical receiver module with demultiplexer for chip-to-chip optical interconnects",
abstract = "In this paper, an integrated optical receiver module with demultiplexer chip-to-chip optical interconnects is proposed. The receiver and demultiplexer (demux) were realized on a single chip in a 0.18 μm TSMC CMOS technology. The topology uses a 1:2 for the demux while the receiver (Rx) module consists of transimpedance amplifier (TIA) and a limiting amplifier (LA). The receiver achieved a gain of 90 dBω and a 3-dB bandwidth of 4.5 GHz. Clear eye diagrams were observed with a voltage swing of 375 mVpp up to 2.5 Gbps output from the Rx-Demux at 5 Gbps input signal. The integrated chip occupies an area of 594x1089 μm2 with power consumptions of 122 mA under a 1.8 V power supply This solution could be applied to CPU/memory interface where bidirectional signaling is required.",
keywords = "Demultiplexer, Limiting amplifier, Optical interconnects, Receiver",
author = "Nguyen, {Nga T.H.} and Ukaegbu, {Ikechi Augustine} and Jamshid Sangirov and Park, {Hyo Hoon}",
year = "2020",
doi = "10.1117/12.2541230",
language = "English",
series = "Proceedings of SPIE - The International Society for Optical Engineering",
publisher = "SPIE",
editor = "Henning Schroder and Chen, {Ray T.}",
booktitle = "Optical Interconnects XX",
address = "United States",
note = "Optical Interconnects XX 2020 ; Conference date: 04-02-2020 Through 06-02-2020",
}