New mechanism of cluster field evaporation in rf breakdown

Z. Insepov, J. H. Norem, A. Hassanein

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The study of the mechanism of cold emission that was caused by high electric field gradients typical of future linacs was discussed. The new mechanism was studied by Molecular Dynamics (MD) simulation of a nanoscale copper tip on a surface of an rf-cavity electrode that was capable of revealing temperature effects. The equations of motion of interacting particles were solved numerically and appropriate initial and boundary conditions were applied in the MD method. The results show that a critical electrical evaporation field was obtained for temperatures that range from room up to the melting point of bulk copper. The simulation results were compared with the available data on FIM tip fracture in a dc electric field.

Original languageEnglish
Title of host publicationTechnical Digest of the 17th International Vacuum Nanoelectronics Conference, IVNC 2004
EditorsA.I. Akinwande, L.-Y. Chen, I. Kymissis, C.-Y. Hong
Pages180-181
Number of pages2
Publication statusPublished - Dec 1 2004
EventTechnical Digest of the 17th International Vacuum Nanoelectronics Conference, IVNC 2004 - Cambridge, MA, United States
Duration: Jul 11 2004Jul 16 2004

Publication series

NameTechnical Digest of the 17th International Vacuum Nanoelectronics Conference, IVNC 2004

Other

OtherTechnical Digest of the 17th International Vacuum Nanoelectronics Conference, IVNC 2004
CountryUnited States
CityCambridge, MA
Period7/11/047/16/04

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ASJC Scopus subject areas

  • Engineering(all)

Cite this

Insepov, Z., Norem, J. H., & Hassanein, A. (2004). New mechanism of cluster field evaporation in rf breakdown. In A. I. Akinwande, L-Y. Chen, I. Kymissis, & C-Y. Hong (Eds.), Technical Digest of the 17th International Vacuum Nanoelectronics Conference, IVNC 2004 (pp. 180-181). (Technical Digest of the 17th International Vacuum Nanoelectronics Conference, IVNC 2004).