On-chip temperature compensation for optical transmitter modules

Jamshid Sangirov, Tae-Woan Park, Ikechi Augustine Ukaegbu, Tae-Woo Lee, Hyo-Hoon Park

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

On-chip temperature compensation (TC) for optical transmitter (Tx) modules is reported. The TC block is integrated in common silicon (Si)-substrate with the Tx and demonstrates the ability to maintain a constant VCSEL output light power without an additional monitoring photodiode. Designed and fabricated in a 0.13 μm technology, the Tx with a TC block operates at up to 5 Gbit/s. A BER of less than 10 -12 is achieved at a received input power of - 3 dBm, with a 1.3 dBm variation of received power for a temperature increase of 20-100°C at 5 Gbit/s data rate. The percentage error of the temperature compensated Tx output light power is ± 3%. The Tx module consumes a power of 20 mW at 1.3 V, including the TC block.
Original languageEnglish
Pages (from-to)202-204
Number of pages2
JournalElectronics Letters
Volume49
Issue number3
Publication statusPublished - Feb 13 2013

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  • Cite this

    Sangirov, J., Park, T-W., Ukaegbu, I. A., Lee, T-W., & Park, H-H. (2013). On-chip temperature compensation for optical transmitter modules. Electronics Letters, 49(3), 202-204.