Optical transceiver with in-chip temperature compensation module design and fabrication

Jamshid Sangirov, Mohammad Rakib Uddin, Gulomjon Sangirov, Ikechi Augustine Ukaegbu, Tae-Woo Lee, Hyo-Hoon Park

Research output: Contribution to journalArticlepeer-review

Abstract

An optical transceiver module with in-chip temperature compensation has been implemented using a 0.13 µm complementary metal oxide semiconductor technology to demonstrate stable light emission with temperature variations. The TRx module works up to 6.125 Gbps data rate and achieves a BER of <10−12 with received power of −11 dBm and input power of −8.2 dBm for Tx and Rx, respectively, at room temperature (25 °C). A measured 3-dB bandwidth of 4.05 and 4.75 GHz are obtained for the transmitter and receiver, respectively. For a temperature increase of 25–100 °C, the temperature compensation effectively works for the Tx module with an increased power of 1.2 dB, whereas temperature uncompensated Rx module input power increases to 3.5 dB at 6.125 Gbps and BER of <10−12.
Original languageEnglish
Pages (from-to)450
JournalOptical and Quantum Electronics
Volume48
Issue number10
Publication statusPublished - Sep 6 2016

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