Optoelectronic subcarrier for chip-to-chip optical PCB applications using long wavelength VCSELs

Ikechi Augustine Ukaegbu, Tae-Woo Lee, Mu-Hee Cho, Hyo-Hoon Park

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

An interconnection scheme for chip-to-chip optical link has been proposed in this work where the silicon substrate of the driver integrated circuit (IC) is used as a subcarrier and also as a light path. This interconnection scheme uses a low loss high speed reconfigurable optical printed circuit board (REOPCB) for coupling light from one chip to the other. A multichip transmitter module has been fabricated with a 1 × 4 top-emitting long wavelength (1310 nm) VCSEL array integrated on it. The driver IC is fabricated in a 0.18 μm Si-CMOS technology with a chip size of 1.1 mm × 1.2 mm × 0.322 mm. 72% of the emitted light from the VCSEL is achieved after transmission through the silicon substrate.
Original languageEnglish
Title of host publication13th International Conference on Advanced Communication Technology (ICACT2011)
PublisherIEEE
Pages481-484
Number of pages4
Publication statusPublished - Apr 7 2011

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