Optoelectronic subcarrier for chip-to-chip optical PCB applications using long wavelength VCSELs

Ikechi Augustine Ukaegbu; Tae-Woo Lee; Mu-Hee Cho; Hyo-Hoon Park

Optoelectronic subcarrier for chip-to-chip optical PCB applications using long wavelength VCSELs

Ikechi Augustine Ukaegbu, Tae-Woo Lee, Mu-Hee Cho, Hyo-Hoon Park

School of Engineering and Digital Sciences

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

An interconnection scheme for chip-to-chip optical link has been proposed in this work where the silicon substrate of the driver integrated circuit (IC) is used as a subcarrier and also as a light path. This interconnection scheme uses a low loss high speed reconfigurable optical printed circuit board (REOPCB) for coupling light from one chip to the other. A multichip transmitter module has been fabricated with a 1 × 4 top-emitting long wavelength (1310 nm) VCSEL array integrated on it. The driver IC is fabricated in a 0.18 μm Si-CMOS technology with a chip size of 1.1 mm × 1.2 mm × 0.322 mm. 72% of the emitted light from the VCSEL is achieved after transmission through the silicon substrate.

Original language	English
Title of host publication	13th International Conference on Advanced Communication Technology (ICACT2011)
Publisher	IEEE
Pages	481-484
Number of pages	4
Publication status	Published - Apr 7 2011

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Cite this

@inproceedings{5a4c7f3ff5ad46299d30ffed652f18dd,

title = "Optoelectronic subcarrier for chip-to-chip optical PCB applications using long wavelength VCSELs",

abstract = "An interconnection scheme for chip-to-chip optical link has been proposed in this work where the silicon substrate of the driver integrated circuit (IC) is used as a subcarrier and also as a light path. This interconnection scheme uses a low loss high speed reconfigurable optical printed circuit board (REOPCB) for coupling light from one chip to the other. A multichip transmitter module has been fabricated with a 1 × 4 top-emitting long wavelength (1310 nm) VCSEL array integrated on it. The driver IC is fabricated in a 0.18 μm Si-CMOS technology with a chip size of 1.1 mm × 1.2 mm × 0.322 mm. 72% of the emitted light from the VCSEL is achieved after transmission through the silicon substrate.",

author = "Ukaegbu, {Ikechi Augustine} and Tae-Woo Lee and Mu-Hee Cho and Hyo-Hoon Park",

year = "2011",

month = apr,

day = "7",

language = "English",

pages = "481--484",

booktitle = "13th International Conference on Advanced Communication Technology (ICACT2011)",

publisher = "IEEE",

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TY - GEN

T1 - Optoelectronic subcarrier for chip-to-chip optical PCB applications using long wavelength VCSELs

AU - Ukaegbu, Ikechi Augustine

AU - Lee, Tae-Woo

AU - Cho, Mu-Hee

AU - Park, Hyo-Hoon

PY - 2011/4/7

Y1 - 2011/4/7

N2 - An interconnection scheme for chip-to-chip optical link has been proposed in this work where the silicon substrate of the driver integrated circuit (IC) is used as a subcarrier and also as a light path. This interconnection scheme uses a low loss high speed reconfigurable optical printed circuit board (REOPCB) for coupling light from one chip to the other. A multichip transmitter module has been fabricated with a 1 × 4 top-emitting long wavelength (1310 nm) VCSEL array integrated on it. The driver IC is fabricated in a 0.18 μm Si-CMOS technology with a chip size of 1.1 mm × 1.2 mm × 0.322 mm. 72% of the emitted light from the VCSEL is achieved after transmission through the silicon substrate.

AB - An interconnection scheme for chip-to-chip optical link has been proposed in this work where the silicon substrate of the driver integrated circuit (IC) is used as a subcarrier and also as a light path. This interconnection scheme uses a low loss high speed reconfigurable optical printed circuit board (REOPCB) for coupling light from one chip to the other. A multichip transmitter module has been fabricated with a 1 × 4 top-emitting long wavelength (1310 nm) VCSEL array integrated on it. The driver IC is fabricated in a 0.18 μm Si-CMOS technology with a chip size of 1.1 mm × 1.2 mm × 0.322 mm. 72% of the emitted light from the VCSEL is achieved after transmission through the silicon substrate.

M3 - Conference contribution

SP - 481

EP - 484

BT - 13th International Conference on Advanced Communication Technology (ICACT2011)

PB - IEEE

ER -