Abstract
An interconnection scheme for chip-to-chip optical link has been proposed in this work where the silicon substrate of the driver integrated circuit (IC) is used as a subcarrier and also as a light path. This interconnection scheme uses a low loss high speed reconfigurable optical printed circuit board (REOPCB) for coupling light from one chip to the other. A multichip transmitter module has been fabricated with a 1 × 4 top-emitting long wavelength (1310 nm) VCSEL array integrated on it. The driver IC is fabricated in a 0.18 μm Si-CMOS technology with a chip size of 1.1 mm × 1.2 mm × 0.322 mm. 72% of the emitted light from the VCSEL is achieved after transmission through the silicon substrate.
Original language | English |
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Title of host publication | 13th International Conference on Advanced Communication Technology (ICACT2011) |
Publisher | IEEE |
Pages | 481-484 |
Number of pages | 4 |
Publication status | Published - Apr 7 2011 |