Abstract
A new parallel dynamic unstructured grid DSMC method is presented in this paper. The code developed has been applied to the simulation of thin film deposition over microstructures. Surface deformation in such cases poses a challenge for accurate evaluation of gas flow due to the fact that the deposited film thickness is comparable to the feature size. In this study a method is developed to move the mesh at run time. Since in parallel simulation each partition moves independently of the others, a parallel version of moving mesh is proposed to synchronize the displacement of the neighboring partitions, so that there is a smooth transition from one partition to another. An efficient tool for tracking particles during simulation is also presented. Furthermore, the influence of parameters, such as sticking coefficient and aspect ratio on step coverage for a 1μm wide trench by sputter deposition was studied. The results showed that the step coverage deteriorated with increasing sticking coefficient and aspect ratio.
Original language | English |
---|---|
Article number | 364262 |
Pages (from-to) | 553-568 |
Number of pages | 16 |
Journal | Journal of Scientific Computing |
Volume | 16 |
Issue number | 4 |
DOIs | |
Publication status | Published - 2001 |
Externally published | Yes |
Keywords
- DSMC
- Dynamic unstructured grid
- Parallel computing
- Thin film deposition
ASJC Scopus subject areas
- Software
- General Engineering
- Computational Mathematics
- Theoretical Computer Science
- Applied Mathematics
- Numerical Analysis
- Computational Theory and Mathematics