Recessed 0.25 μm gate AlGaN/GaN HEMTs on SiC with high gate-drain breakdown voltage using ICP-RIE

V. Kumar, W. Lu, F. A. Khan, R. Schwindt, E. Piner, I. Adesida

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Using inductively coupled plasma reactive ion etching (ICP-RIE), recessed 0.25 μm gate-length AlGaN/GaN high electron mobility transistors (HEMTs) have been fabricated. A post-etch anneal eliminated the plasma-induced damage resulting in an improvement of the gate-drain breakdown voltage from -27 V for the as-etched to over -90 V for the annealed devices. The gate leakage current reduced from 91 to 4μA at Vgd = -25 V, after annealing. These devices exhibited maximum drain current density of 770 mA/mm, unity gain cutoff frequency (fT) of 48 GHz, and maximum frequency of oscillation (fmax) of 108 GHz.

Original languageEnglish
Pages (from-to)1483-1485
Number of pages3
JournalElectronics Letters
Issue number24
Publication statusPublished - Nov 22 2001


ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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