The design of Si-based Fresnel-zone lens for 3D IC optical interconnect applications

Ikechi A. Ukaegbu, Hyo Hoon Park

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this work, we design a Si-based Fresnel-zone lens for a hybrid 3D integrated circuit (3D IC) solution. The 3D IC solution consists of two layers of transceiver modules which are mounted at several points on an optical printed circuit board (OPCB) for seamleß transmißion of signal through each layer to the OPCB and vice versa. Each transceiver module is made up of a Si-subcarrier (Si layer), transceiver IC, laser diode (VCSEL) and photodiode (PD). The transceiver IC, LD and PD are flip-chip bonded to the Si-subcarrier. Fresnel-zone lens are designed on the transmißion surface of each of the Si-subcarriers to improve coupling efficiency, transmittance through the silicon substrate, reduce surface scattering, and improve focusing. Each of the Si-subcarrier with the transceiver modules are flip-chip bonded together and also flip-chip bonded to the optical PCB. A 2-level and 4-level Fresnel-zone lens are designed at 1.3μm and 1.55μm. Based on design parameters such as coupling efficiency, transmittance, leß design complexity, and ease of fabrication, the 4-level Fresnel zone lens was selected as the optimal design for 3D IC and optical PCB applications. The optimal 4-level Fresnel-zone lens are designed for λ=1.3μm, where the focal length, f is 350μm, and diameter, D, is 167μm; and for λ=1.55μm, where the focal length, f is 350μm, and diameter, D, is 169.2μm. Also the plots of coupling efficiency and transmittance are provided for applications in 3D IC optical interconnects.

Original languageEnglish
Title of host publicationSmart Photonic and Optoelectronic Integrated Circuits XXII
EditorsSailing He, Sailing He, Laurent Vivien
PublisherSPIE
ISBN (Electronic)9781510633315
DOIs
Publication statusPublished - 2020
EventSmart Photonic and Optoelectronic Integrated Circuits XXII 2020 - San Francisco, United States
Duration: Feb 3 2020Feb 6 2020

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume11284
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Conference

ConferenceSmart Photonic and Optoelectronic Integrated Circuits XXII 2020
CountryUnited States
CitySan Francisco
Period2/3/202/6/20

Keywords

  • 291 Daehak-ro
  • Deajeon
  • Department of Electrical Engineering
  • Korea Advanced Institute of Science and Technology (KAIST)
  • South Korea

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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