The influence of dielectric dissipation factor on transformer Frequency Response Analysis

Mehdi Bagheri, B. T. Phung, Trevor Blackburn

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Frequency Response Analysis (FRA) is regarded as a robust technique to recognize transformer winding deformation. It has been implemented and used since the last decade. However, its interpretation and measurement sensitivity are still under development. Recent studies reveal that apart from winding deformation, FRA data can also be influenced by moisture variation in transformer paper insulation. Technically speaking, moisture variation will certainly influence the Dielectric Dissipation Factor (DDF) in transformer. Therefore, it is of interest to investigate the correlation between DDF value and FRA spectrum. A model transformer was fabricated for this study and the experiment was concentrated on the temperature changes and paper moisture variation and eventually DDF alteration on the FRA spectrum deviation. DDF was measured for the 'wet' and 'dry' model transformer at different temperatures. In parallel, the FRA spectrum was also recorded. The correlation between the transformer DDF value and FRA spectrum is highlighted and discussed.

Original languageEnglish
Title of host publication2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages634-637
Number of pages4
ISBN (Electronic)9781479975235
DOIs
Publication statusPublished - Dec 22 2014
Externally publishedYes
Event2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014 - Des Moines, United States
Duration: Oct 19 2014Oct 22 2014

Other

Other2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014
CountryUnited States
CityDes Moines
Period10/19/1410/22/14

Fingerprint

Frequency response
Spectrum analysis
Moisture
Transformer windings
Insulation
Temperature
Experiments

Keywords

  • Dielectric Dissipation Factor
  • Frequency Response Analysis
  • Moisture Variation
  • Transformer
  • Winding Deformation

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Bagheri, M., Phung, B. T., & Blackburn, T. (2014). The influence of dielectric dissipation factor on transformer Frequency Response Analysis. In 2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014 (pp. 634-637). [6995890] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/CEIDP.2014.6995890

The influence of dielectric dissipation factor on transformer Frequency Response Analysis. / Bagheri, Mehdi; Phung, B. T.; Blackburn, Trevor.

2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014. Institute of Electrical and Electronics Engineers Inc., 2014. p. 634-637 6995890.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Bagheri, M, Phung, BT & Blackburn, T 2014, The influence of dielectric dissipation factor on transformer Frequency Response Analysis. in 2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014., 6995890, Institute of Electrical and Electronics Engineers Inc., pp. 634-637, 2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014, Des Moines, United States, 10/19/14. https://doi.org/10.1109/CEIDP.2014.6995890
Bagheri M, Phung BT, Blackburn T. The influence of dielectric dissipation factor on transformer Frequency Response Analysis. In 2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014. Institute of Electrical and Electronics Engineers Inc. 2014. p. 634-637. 6995890 https://doi.org/10.1109/CEIDP.2014.6995890
Bagheri, Mehdi ; Phung, B. T. ; Blackburn, Trevor. / The influence of dielectric dissipation factor on transformer Frequency Response Analysis. 2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014. Institute of Electrical and Electronics Engineers Inc., 2014. pp. 634-637
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