Thermal effect analysis on crosstalk and performance of optoelectronic transmitter modules for optical interconnects

Ikechi Augustine Ukaegbu, Mohammad Rakib Uddin, Jamshid Sangirov, Nga T. H. Nguyen, Tae-Woo Lee, Mu-Hee Cho, Hyo-Hoon Park

Research output: Contribution to journalArticle

Abstract

This paper presents thermal analysis on crosstalk and performance of optoelectronic transmitter modules and also demonstrates the thermal analysis for efficient heat dissipation for the transmitter modules. The thermal crosstalk model for analysis is based on interconnects parameters for vertically stacked and horizontally packaged optoelectronic transmitter modules. While the analytical expression is used to estimate the thermal critical frequency, f crit_th , above which signals become severely deteriorated, a Teflon-based thermal printed circuit board (PCB) has been designed for packaging the optoelectronic transmitter modules to ensure efficient heat dissipation. The thermal and performance analysis of the packaged modules show that the chips operate at temperatures below the f crit_th , which is apt for reliable data and signal transmission.
Original languageEnglish
Pages (from-to)277
JournalOptical and Quantum Electronics
Volume49
Issue number8
Publication statusPublished - Jul 24 2017

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optical interconnects
Optical interconnects
Crosstalk
crosstalk
Optoelectronic devices
Thermal effects
transmitters
temperature effects
Transmitters
modules
Heat losses
thermal analysis
Thermoanalysis
Polytetrafluoroethylene
cooling
Polytetrafluoroethylenes
critical frequencies
signal transmission
Printed circuit boards
teflon (trademark)

Cite this

Thermal effect analysis on crosstalk and performance of optoelectronic transmitter modules for optical interconnects. / Ukaegbu, Ikechi Augustine; Uddin, Mohammad Rakib; Sangirov, Jamshid; Nguyen, Nga T. H.; Lee, Tae-Woo; Cho, Mu-Hee; Park, Hyo-Hoon.

In: Optical and Quantum Electronics, Vol. 49, No. 8, 24.07.2017, p. 277.

Research output: Contribution to journalArticle

Ukaegbu, IA, Uddin, MR, Sangirov, J, Nguyen, NTH, Lee, T-W, Cho, M-H & Park, H-H 2017, 'Thermal effect analysis on crosstalk and performance of optoelectronic transmitter modules for optical interconnects', Optical and Quantum Electronics, vol. 49, no. 8, pp. 277.
Ukaegbu, Ikechi Augustine ; Uddin, Mohammad Rakib ; Sangirov, Jamshid ; Nguyen, Nga T. H. ; Lee, Tae-Woo ; Cho, Mu-Hee ; Park, Hyo-Hoon. / Thermal effect analysis on crosstalk and performance of optoelectronic transmitter modules for optical interconnects. In: Optical and Quantum Electronics. 2017 ; Vol. 49, No. 8. pp. 277.
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