Thermal Effects on Interconnect Crosstalk of Optoelectronic Transmitter Modules

Ikechi Augustine Ukaegbu; Jamshid Sangirov; Bikash Nakarmi; Tae-Woo Lee; Mu-Hee Cho; Hyo-Hoon Park

Thermal Effects on Interconnect Crosstalk of Optoelectronic Transmitter Modules

Ikechi Augustine Ukaegbu, Jamshid Sangirov, Bikash Nakarmi, Tae-Woo Lee, Mu-Hee Cho, Hyo-Hoon Park

School of Engineering and Digital Sciences

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

An analytical model based on interconnect parameters is presented for the analysis of thermal effects on crosstalk and performance of multi-channel optoelectronic modules. The model is accurate for computing crosstalk of interconnects used in chip packaging. In addition, model is used to determine the thermal critical frequency, fcrit, above which signals becomes severely deteriorated and can be applied in the design and packaging of optoelectronic transmitter modules for reliable data transmission.

Original language	English
Title of host publication	Optoelectronic Devices and Integration IV, SPIE/COS, Photonics Asia
Publisher	SPIE
Pages	85551Y
Publication status	Published - Nov 27 2012

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@inproceedings{f5fa567ce1b545c7988ce2530c67a9b0,

title = "Thermal Effects on Interconnect Crosstalk of Optoelectronic Transmitter Modules",

abstract = "An analytical model based on interconnect parameters is presented for the analysis of thermal effects on crosstalk and performance of multi-channel optoelectronic modules. The model is accurate for computing crosstalk of interconnects used in chip packaging. In addition, model is used to determine the thermal critical frequency, fcrit, above which signals becomes severely deteriorated and can be applied in the design and packaging of optoelectronic transmitter modules for reliable data transmission.",

author = "Ukaegbu, {Ikechi Augustine} and Jamshid Sangirov and Bikash Nakarmi and Tae-Woo Lee and Mu-Hee Cho and Hyo-Hoon Park",

year = "2012",

month = nov,

day = "27",

language = "English",

pages = "85551Y",

booktitle = "Optoelectronic Devices and Integration IV, SPIE/COS, Photonics Asia",

publisher = "SPIE",

address = "United States",

}

TY - GEN

T1 - Thermal Effects on Interconnect Crosstalk of Optoelectronic Transmitter Modules

AU - Ukaegbu, Ikechi Augustine

AU - Sangirov, Jamshid

AU - Nakarmi, Bikash

AU - Lee, Tae-Woo

AU - Cho, Mu-Hee

AU - Park, Hyo-Hoon

PY - 2012/11/27

Y1 - 2012/11/27

N2 - An analytical model based on interconnect parameters is presented for the analysis of thermal effects on crosstalk and performance of multi-channel optoelectronic modules. The model is accurate for computing crosstalk of interconnects used in chip packaging. In addition, model is used to determine the thermal critical frequency, fcrit, above which signals becomes severely deteriorated and can be applied in the design and packaging of optoelectronic transmitter modules for reliable data transmission.

AB - An analytical model based on interconnect parameters is presented for the analysis of thermal effects on crosstalk and performance of multi-channel optoelectronic modules. The model is accurate for computing crosstalk of interconnects used in chip packaging. In addition, model is used to determine the thermal critical frequency, fcrit, above which signals becomes severely deteriorated and can be applied in the design and packaging of optoelectronic transmitter modules for reliable data transmission.

M3 - Conference contribution

SP - 85551Y

BT - Optoelectronic Devices and Integration IV, SPIE/COS, Photonics Asia

PB - SPIE

ER -