Thermal Effects on Interconnect Crosstalk of Optoelectronic Transmitter Modules

Ikechi Augustine Ukaegbu, Jamshid Sangirov, Bikash Nakarmi, Tae-Woo Lee, Mu-Hee Cho, Hyo-Hoon Park

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

An analytical model based on interconnect parameters is presented for the analysis of thermal effects on crosstalk and performance of multi-channel optoelectronic modules. The model is accurate for computing crosstalk of interconnects used in chip packaging. In addition, model is used to determine the thermal critical frequency, fcrit, above which signals becomes severely deteriorated and can be applied in the design and packaging of optoelectronic transmitter modules for reliable data transmission.
Original languageEnglish
Title of host publicationOptoelectronic Devices and Integration IV, SPIE/COS, Photonics Asia
PublisherSPIE
Pages85551Y
Publication statusPublished - Nov 27 2012

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