An analytical model based on interconnect parameters is presented for the analysis of thermal effects on crosstalk and performance of multi-channel optoelectronic modules. The model is accurate for computing crosstalk of interconnects used in chip packaging. In addition, model is used to determine the thermal critical frequency, fcrit, above which signals becomes severely deteriorated and can be applied in the design and packaging of optoelectronic transmitter modules for reliable data transmission.
|Title of host publication||Optoelectronic Devices and Integration IV, SPIE/COS, Photonics Asia|
|Publication status||Published - Nov 27 2012|