Thermal management of mobile phone using phase change material

F. L. Tan, S. C. Fok

Research output: Chapter in Book/Report/Conference proceedingConference contribution

29 Citations (Scopus)


The power of the handheld electronics devices continues to increase because packaging advances reduce their size even as more features are added and enhanced. The computational fluid dynamics (CFD) numerical simulation is performed on thermal management of the mobile phone using a heat storage unit (HSU) filled with the phase change material (PCM). The chips and HSU are embedded in an epoxy polymer casing. The PCM absorbs the heat dissipation from the chips and stores as latent heat to maintain the chip temperature below the allowable service temperature. Eight cases of simulations are carried out with or without PCM at several power dissipations. The use of PCM in mobile phone has shown to be effective in keeping the chip temperature down to acceptable level for certain duration.

Original languageEnglish
Title of host publication9th Electronics Packaging Technology Conference, EPTC 2007
Number of pages7
ISBN (Print)1424413249, 9781424413249
Publication statusPublished - 2007
Event9th Electronics Packaging Technology Conference, EPTC 2007 - , Singapore
Duration: Dec 12 2007Dec 12 2007

Publication series

Name2007 9th Electronics Packaging Technology Conference


Conference9th Electronics Packaging Technology Conference, EPTC 2007


  • CFD numerical simulation
  • Computational fluid dynamics
  • Electronic packaging thermal management
  • Material storage
  • Mobile handsets
  • Numerical simulation
  • Phase change materials
  • Polymers
  • Temperature
  • Thermal management
  • Thermal management of electronics
  • chip temperature
  • computational fluid dynamics
  • cooling
  • epoxy polymer casing
  • heat conduction
  • heat dissipation absorption
  • heat storage unit
  • latent heat
  • mobile handsets
  • mobile phone
  • natural convection
  • numerical analysis
  • packaging
  • phase change material
  • phase change materials
  • polymers
  • power dissipations
  • thermal management
  • thermal management (packaging)

ASJC Scopus subject areas

  • Engineering(all)

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