Abstract
The power of the handheld electronics devices continues to increase because packaging advances reduce their size even as more features are added and enhanced. The computational fluid dynamics (CFD) numerical simulation is performed on thermal management of the mobile phone using a heat storage unit (HSU) filled with the phase change material (PCM). The chips and HSU are embedded in an epoxy polymer casing. The PCM absorbs the heat dissipation from the chips and stores as latent heat to maintain the chip temperature below the allowable service temperature. Eight cases of simulations are carried out with or without PCM at several power dissipations. The use of PCM in mobile phone has shown to be effective in keeping the chip temperature down to acceptable level for certain duration.
| Original language | English |
|---|---|
| Title of host publication | 9th Electronics Packaging Technology Conference, EPTC 2007 |
| Publisher | IEEE |
| Pages | 836-842 |
| Number of pages | 7 |
| ISBN (Print) | 1424413249, 9781424413249 |
| DOIs | |
| Publication status | Published - 2007 |
| Event | 9th Electronics Packaging Technology Conference, EPTC 2007 - , Singapore Duration: Dec 12 2007 → Dec 12 2007 |
Publication series
| Name | 2007 9th Electronics Packaging Technology Conference |
|---|
Conference
| Conference | 9th Electronics Packaging Technology Conference, EPTC 2007 |
|---|---|
| Country | Singapore |
| Period | 12/12/07 → 12/12/07 |
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Keywords
- CFD numerical simulation
- Computational fluid dynamics
- Electronic packaging thermal management
- Material storage
- Mobile handsets
- Numerical simulation
- Phase change materials
- Polymers
- Temperature
- Thermal management
- Thermal management of electronics
- chip temperature
- computational fluid dynamics
- cooling
- epoxy polymer casing
- heat conduction
- heat dissipation absorption
- heat storage unit
- latent heat
- mobile handsets
- mobile phone
- natural convection
- numerical analysis
- packaging
- phase change material
- phase change materials
- polymers
- power dissipations
- thermal management
- thermal management (packaging)
ASJC Scopus subject areas
- Engineering(all)
Cite this
Thermal management of mobile phone using phase change material. / Tan, F. L.; Fok, S. C.
9th Electronics Packaging Technology Conference, EPTC 2007. IEEE, 2007. p. 836-842 4469773 (2007 9th Electronics Packaging Technology Conference).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Thermal management of mobile phone using phase change material
AU - Tan, F. L.
AU - Fok, S. C.
PY - 2007
Y1 - 2007
N2 - The power of the handheld electronics devices continues to increase because packaging advances reduce their size even as more features are added and enhanced. The computational fluid dynamics (CFD) numerical simulation is performed on thermal management of the mobile phone using a heat storage unit (HSU) filled with the phase change material (PCM). The chips and HSU are embedded in an epoxy polymer casing. The PCM absorbs the heat dissipation from the chips and stores as latent heat to maintain the chip temperature below the allowable service temperature. Eight cases of simulations are carried out with or without PCM at several power dissipations. The use of PCM in mobile phone has shown to be effective in keeping the chip temperature down to acceptable level for certain duration.
AB - The power of the handheld electronics devices continues to increase because packaging advances reduce their size even as more features are added and enhanced. The computational fluid dynamics (CFD) numerical simulation is performed on thermal management of the mobile phone using a heat storage unit (HSU) filled with the phase change material (PCM). The chips and HSU are embedded in an epoxy polymer casing. The PCM absorbs the heat dissipation from the chips and stores as latent heat to maintain the chip temperature below the allowable service temperature. Eight cases of simulations are carried out with or without PCM at several power dissipations. The use of PCM in mobile phone has shown to be effective in keeping the chip temperature down to acceptable level for certain duration.
KW - CFD numerical simulation
KW - Computational fluid dynamics
KW - Electronic packaging thermal management
KW - Material storage
KW - Mobile handsets
KW - Numerical simulation
KW - Phase change materials
KW - Polymers
KW - Temperature
KW - Thermal management
KW - Thermal management of electronics
KW - chip temperature
KW - computational fluid dynamics
KW - cooling
KW - epoxy polymer casing
KW - heat conduction
KW - heat dissipation absorption
KW - heat storage unit
KW - latent heat
KW - mobile handsets
KW - mobile phone
KW - natural convection
KW - numerical analysis
KW - packaging
KW - phase change material
KW - phase change materials
KW - polymers
KW - power dissipations
KW - thermal management
KW - thermal management (packaging)
UR - http://www.scopus.com/inward/record.url?scp=50049127558&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=50049127558&partnerID=8YFLogxK
U2 - 10.1109/EPTC.2007.4469773
DO - 10.1109/EPTC.2007.4469773
M3 - Conference contribution
AN - SCOPUS:50049127558
SN - 1424413249
SN - 9781424413249
T3 - 2007 9th Electronics Packaging Technology Conference
SP - 836
EP - 842
BT - 9th Electronics Packaging Technology Conference, EPTC 2007
PB - IEEE
ER -