@inproceedings{0edda18931b548ad9a60f74100d2d6ab,
title = "Thermal management of mobile phone using phase change material",
abstract = "The power of the handheld electronics devices continues to increase because packaging advances reduce their size even as more features are added and enhanced. The computational fluid dynamics (CFD) numerical simulation is performed on thermal management of the mobile phone using a heat storage unit (HSU) filled with the phase change material (PCM). The chips and HSU are embedded in an epoxy polymer casing. The PCM absorbs the heat dissipation from the chips and stores as latent heat to maintain the chip temperature below the allowable service temperature. Eight cases of simulations are carried out with or without PCM at several power dissipations. The use of PCM in mobile phone has shown to be effective in keeping the chip temperature down to acceptable level for certain duration.",
keywords = "CFD numerical simulation, Computational fluid dynamics, Electronic packaging thermal management, Material storage, Mobile handsets, Numerical simulation, Phase change materials, Polymers, Temperature, Thermal management, Thermal management of electronics, chip temperature, computational fluid dynamics, cooling, epoxy polymer casing, heat conduction, heat dissipation absorption, heat storage unit, latent heat, mobile handsets, mobile phone, natural convection, numerical analysis, packaging, phase change material, phase change materials, polymers, power dissipations, thermal management, thermal management (packaging)",
author = "Tan, {F. L.} and Fok, {S. C.}",
year = "2007",
doi = "10.1109/EPTC.2007.4469773",
language = "English",
isbn = "1424413249",
series = "2007 9th Electronics Packaging Technology Conference",
publisher = "IEEE",
pages = "836--842",
booktitle = "9th Electronics Packaging Technology Conference, EPTC 2007",
note = "9th Electronics Packaging Technology Conference, EPTC 2007 ; Conference date: 12-12-2007 Through 12-12-2007",
}