Wear behaviour of PCD micro-tool while vertical microgrinding of BK7 glass

Asma Perveen, Y. S. Wong, M. Rahman

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Being brittle material, glass material is usually fabricated using photolithography and etching process, which are time consuming as well as involve chemical hazards. Therefore, researches are being carried out for fabricating glass micro features by various micromachining processes like grinding, milling, and turning. However, one of the major problems existing in these micromachining processes is the tool wear. This becomes more severe in the case of micro-grinding than in conventional grinding since micro grinding wheel is more sensitive to tool wear. Hence, this paper deals with the wear behavior of Polycrystalline Diamond (PCD) micro tool during micro grinding of Bk7 glass. An on-machine fabricated PCD tool of 670 μm diameter was used to micro-ground almost 65 slots keeping the same cutting conditions of feed rate 10μm/mint, depth of cut 5μm, and spindle speed 2000 rpm. It was found that tool wear caused the diameter reduction as well as length reduction. SEM image of the tool surface gave the clear indication of edge chipping and abrasion type of tool wear where grain pull out, microcracks and built up edge mechanism are responsible for these wear mode.

Original languageEnglish
Title of host publicationProceedings of the 11th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2011
EditorsP. Shore, Henny Spaan, H. Van Brussel, Theresa Burke
Publishereuspen
Pages501-504
Number of pages4
ISBN (Electronic)9780955308291
Publication statusPublished - Jan 1 2011
Event11th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2011 - Como, Italy
Duration: May 23 2011May 26 2011

Publication series

NameProceedings of the 11th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2011
Volume2

Other

Other11th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2011
CountryItaly
CityComo
Period5/23/115/26/11

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Mechanical Engineering
  • Materials Science(all)
  • Instrumentation
  • Environmental Engineering

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